TSOP, SSOP, and PSOP Package Dimensions and Land-Pad Drawings

Intel Corp. (Folsom)

Architecture:
Type :
Last Update:

Flash Memory Components Bulk Erase
Packaging Information
12/23/97 3:38:16 PM

Vendor Information

Tool Description:

Provides package and land-pad dimensions for all lead count 32,40,48, and 56L TSOP, 44L PSOP, and 56L SSOP packages.

Tool Features:

TSOP package and land-pad dimensions located on attachment file 2290.doc

SSOP package and land-pad dimensions located on attachment file 2231.doc

PSOP package and land-pad dimensions located on attachment file 2232.doc

File Attachments:

2231.DOC - SSOP package and land-pad dimensions
2232.DOC - PSOP package and land-pad dimensions
2290.DOC - TSOP package and land-pad dimensions

Supported Device Detail Matrix:

Part & Package

28F010 - TSOP-32 ld
28F010 - TSOP-32 ld(R)
28F020 - TSOP-32 ld
28F020 - TSOP-32 ld(R)

Vendor Information:

Intel Corp. (Folsom)

1900 Prairie City Road
Folsom , CA 95630
USA

Tech : (916) 356-3104
Email : flash@inside.intel.com
Fax : (916) 356-2803
Toll Free : (800) 628-8686
BBS : (916) 356-3600
URL : http://developer.intel.com

Contact the vendor above for the latest Distributor information

	Part & Package
	28F010 - TSOP-32 ld 28F010 - TSOP-32 ld(R) 28F020 - TSOP-32 ld 28F020 - TSOP-32 ld(R)